SEMICON India 2026 Concludes in New Delhi, Highlighting $15 Billion Chip Outlay and Global Partnerships
The landmark fifth edition of SEMICON India concluded at the Yashobhoomi Convention Centre in New Delhi, marking a major milestone in India's ambition to become a global semiconductor manufacturing hub. Organised jointly by the India Semiconductor Mission (ISM) and global industry body SEMI, the three-day event recorded over 51,000 registrations and brought together representatives from 52 nations. The conference featured six international pavilions—including Japan, South Korea, Singapore, and the Netherlands—alongside 12 Indian state pavilions and over 600 technology exhibitors.
Inaugurating the summit, Prime Minister Narendra Modi highlighted India’s swift transition from semiconductor policy formulation to actual commercial chip production. During the event, commercial production lines were virtually launched at CDIL Semiconductor in Mohali and Suchi Semicon in Surat, bringing the total number of operational chip facilities under the initial Semicon 1.0 program to five. Union IT Minister Ashwini Vaishnaw outlined the roadmap for 'Semicon 2.0', backed by a massive Rs 1,27,500 crore ($15 billion) outlay approved by the Union Cabinet. This expanded phase prioritises advanced chip packaging, specialized machinery and materials, indigenous fab construction, and chip design talent development.
Throughout the three days, over 56 Memorandums of Understanding (MoUs) and strategic announcements were signed between domestic startups, academic institutions, and global semiconductor leaders. For the public and technology industry, SEMICON India 2026 underscores India's growing role in securing global supply chains, fostering local hardware innovation, and creating high-skilled engineering jobs across the country.
