SUSS MicroTec and Manz Asia Form Strategic Partnership to Advance Semiconductor Inkjet Technology

On September 3, 2026, German semiconductor equipment manufacturer SUSS MicroTec announced a strategic collaboration with Manz Asia to advance inkjet technology in semiconductor manufacturing and advanced packaging applications. The joint effort aims to combine SUSS's deep expertise in semiconductor process equipment and advanced packaging with Manz Asia's digital printing, wet chemistry, and manufacturing capabilities. Market analysts project the serviceable equipment market for semiconductor inkjet applications to exceed $800 million by 2030, driven by the increasing complexity of microchip architectures and panel-level packaging requirements. Compared to traditional coating methods, inkjet printing provides significant material savings, improved cost efficiency, and highly uniform chemical deposition across intricate three-dimensional chip structures. This partnership allows both companies to accelerate time-to-market for scalable industrial printing solutions designed for high-volume semiconductor fabrication.